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H3C UniServer R4700 G6 1U Dual Socket Rack Server
$7,900.00 – $15,000.00Price range: $7,900.00 through $15,000.00
H3C UniServer R4700 G6 Compact 1U Enterprise Rack Server Full Introduction
H3C UniServer R4700 G6 belongs to H3C sixth-generation G6 enterprise rack server lineup, a space-saving 1U dual-socket rackmount solution engineered for high-density data center rack deployment, cloud node construction and medium-sized enterprise core business operation. Balancing compact cabinet footprint, robust computing power and diversified expandability, this 1U server covers diversified mainstream IT demands from virtualization clusters to distributed storage nodes.
Dual-Socket 4th & 5th Gen Intel Xeon Computing Architecture
Equipped with two LGA4677 processor sockets, R4700 G6 fully supports 4th and 5th generation Intel Xeon Scalable processors with varying core counts and TDP grades. Advanced motherboard power regulation circuitry stabilizes voltage output under long-duration full-load status, allowing consistent computing output during continuous batch calculation, container cluster scheduling and core database transaction processing without performance throttling.
High-Capacity DDR5 Multi-Channel ECC Memory System
The platform is designed with abundant DDR5 memory slots adopting multi-channel transmission framework, compatible with enterprise-grade ECC RDIMM DDR5 memory modules at elevated operating frequency. Built-in memory error checking and correction mechanism automatically fixes transient data faults during operation, effectively enhancing system stability when loading large virtual machine resource pools and massive business data cache.
Dual Optional Front Storage Bay Layout Design
H3C customizes two mature front storage specifications for R4700 G6 to satisfy differentiated storage requirements: compact 4×2.5-inch drive configuration and high-density 10×2.5-inch hot-swap bay layout. All drive slots support hot-plug SAS4.0, SATA3.0 and PCIe NVMe U.2 solid-state drives, enabling users to build all-flash high IOPS storage array or mixed SSD+HDD storage architecture flexibly according to project cost and performance targets.
Full PCIe 5.0 High-Speed Expansion Capability
Integrated complete PCIe 5.0 bus channel on mainboard with multiple standard PCIe expansion slots, backward compatible with PCIe4.0 and PCIe3.0 peripheral hardware. Users can install high-speed OCP3.0 network adapters, RAID acceleration cards and low-profile computing accelerator cards to expand 25G/100G fiber network connectivity or hardware RAID protection for enterprise storage groups.
Optimized Front Grille Intelligent Thermal Dissipation
The front panel adopts large-area honeycomb ventilation grille structure to boost cold air intake volume, paired with modular hot-swappable fan array supporting intelligent rotational speed adjustment based on internal hardware temperature. Optimized internal air duct design forms straight-through airflow path, efficiently discharging heat generated by dual CPUs and high-speed storage drives while controlling running noise within standard data center range.
HDM2 Intelligent Out-of-Band Remote Management
Preloaded H3C exclusive HDM2 management controller built on AST2600 chip with independent dedicated management Ethernet port. This system complies with IPMI2.0, Redfish and SNMP mainstream industry management protocols, enabling remote power on/off, real-time hardware status monitoring, fault alert push, virtual media mounting and remote KVM control without local on-site access for IT administrators.
Enterprise-Grade Redundant Reliability Configuration
R4700 G6 supports optional 1+1 redundant CRPS high-efficiency power supply with platinum-level energy conversion efficiency. Once single power unit fails, the spare power module instantly takes over full load without business interruption. All core replaceable components including fans and hard drives adopt hot-swappable design to shorten hardware replacement downtime and reduce unexpected service outage risk for mission-critical applications.
Rich Front & Rear Multi-Spec I/O Interfaces
Front panel reserves convenient USB and indicator interfaces for rapid local debugging, while rear panel integrates multiple USB ports, VGA video port, multi-speed RJ45 Ethernet ports and dedicated HDM management port. Abundant peripheral connections facilitate quick access of external debugging equipment, multi-network segment deployment and diversified external storage linkage for enterprise daily operation.
Broad Compatibility With Mainstream Operating Systems
The server passes full compatibility verification with Windows Server series, RedHat Enterprise Linux, SUSE Linux, Ubuntu and mainstream virtualization platforms including VMware ESXi, KVM. Stable OS adaptability guarantees seamless running of database software, virtualization management platform, big data middleware and industry customized business applications.
Main Applicable Industrial Deployment Scenarios
- Enterprise private cloud compute node and server virtualization cluster construction
- Medium & small enterprise core database, OA and enterprise application server
- All-flash distributed storage node and backup storage service equipment
- IDC hosting, cloud edge computing node and lightweight container cluster
- Government, education and retail industry unified business computing server
H3C UniServer R4700 G6 1U rack server provides optional 4-bay 3.5 inch LFF or 10-bay 2.5-inch SFF hot-swap drive layout to realize flexible high-density NVMe SSD storage deployment for all-flash business.
Optimized large-area front honeycomb air grille of H3C R4700 G6 improves inlet airflow and guarantees steady heat dissipation under full load of dual 4th/5th Gen Intel Xeon processors.
Compact standard 1U rack chassis of H3C R4700 G6 saves cabinet space and supports dense rack installation for large-scale data center server cluster construction.
Custom Demo BOM Configuration
| BOM Code | PID | Description | Qty |
|---|---|---|---|
| 0235A4FY | UN-R4700-G6-SFF-C | H3C UniServer R4700 G6 SFF Air-Cooled CTO Server | 1 |
| 0231AK80 | UN-CPU-INTEL-6430 | 6430(2.1GHz/32Cores/60MB/270W) CPU Module(CTO&BTO) | 2 |
| 0231AMLJ | UN-DDR5-5600B-64G-2Rx4-R-2 | 64GB 2Rx4 DDR5-5600B(CAS-46-45-45) SAMSUNG&HYNIX RDIMM Memory Module(CTO&BTO) | 2 |
| 0231AJV8 | UN-PCA-BP-8UniBay-1U-G6 | 8SFF SATA3/SAS4/PCIe5.0 1U Drive Backplane Module (8Unibay)(CTO&BTO) | 1 |
| 0231AH1G | UN-SSD-480G-SATA-PM893-UCS | 480GB 6Gb/s SATA 2.5in RI PM893 SSD UCS Generic Module (CTO&BTO) | 2 |
| 0231ANSH | UN-NIC-ETH-SF400T-C201-3S-4P | 4-Port 1Gb/s PCIe2.1 x4 Copper Interface SF400T-C201 OCP3.0 Ethernet Adapter (Netswift WX1860A4)(CTO&BTO) | 1 |
| 0231AS24 | UN-GW-CRPS1300N2 | 1300W AC&240V HVDC Power Supply (GW-R3-Platinum-Light Load High Efficiency)(CTO&BTO) | 2 |
| 0404A0K4 | CAB-PDU-2.0m-C14-C13-MUL-50598 | AC Jumper Cord,2.0m,1.0mm^2,Black,C14C(3P)STM250V10A,227 IEC 53(RVV)&H05VV-F&SJT,C13,CCC/UL/EU/KC | 2 |
| 0231AJV7 | UN-FAN-4056-1U-G6 | 4056 Generic 1U Fan Module (CTO&BTO) | 8 |
| 0231AK7E | UN-ME-HeatSink-1UbY-M | 1U T Type Heat Pipe Heat Sink Module(CMCTO) | 2 |
| 3132A1DG | LIS-SW-NingOS-V3-SVR | H3C Ning Operating System V3 (Physical Host Edition) License, 1 Node | 1 |
| 0231AJQ5 | UN-IFIST-EX-G6 | G6 iFIST Module (CTO&BTO) | 1 |
| 0231AFT2 | UN-RL-B-G5 | G5 2U/1U Standard Rail Kit(CTO&BTO) | 1 |
| 0404A1RE | CAB-SAS-0.8m-00618 | SAS Cable,0.8m,2*(SlimSAS 38PST),SAS 4.0+UL1354,SlimSAS 74PST | 1 |
| 0404A1WW | CAB-DC-0.35m-50897 | Internal DC Power Cable,0.35m,HMB(3*2)3.0,UL1061,HMB(3*2)3.0 | 1 |
| 0404A1QW | CAB-AUX-0.5m-10554 | AUX Signal Cable,0.5m,HMB(6*1)1.25,UL2835,HMB(6*1)1.25 | 1 |
| 8814A0CP | SV-PS-UN | H3C Server Installation and Startup Service | 1 |
| 8813A4GL | SV-MA-BS3-UN | 3Y 7×24×4 Onsite Support | 1 |
| 8813A4N8 | SV-MA-LINUX-RSDS-1Y | 1Y 7×24 Software Remote Technical Support | 1 |
Technical Specifications
| Specification Items | Official Parameters, Supported Protocols & Functions |
|---|---|
| Product Form Factor | Standard 19-inch rack-mounted 1U chassis, air cooling architecture for data center cabinet deployment |
| CPU Platform & Socket | Dual LGA4677 sockets, compatible with 4th & 5th Gen Intel Xeon Scalable Processors, max CPU TDP up to 270W |
| Memory Specifications | Multi-channel DDR5 ECC RDIMM/LRDIMM, support memory error correction, memory sparing & memory mirror protection function |
| Front Storage Bay Options | Optional 4×3.5-inch or high-density 10×2.5-inch hot-swap drive bay layout |
| Supported Storage Protocols | SATA 3.0, SAS 4.0, PCIe 5.0 NVMe U.2 protocol; full support for hot-plug HDD, SATA SSD & NVMe all-flash drives |
| RAID Control Functions | Compatible with hardware RAID adapters, supports RAID 0/1/5/6/10/50/60, supports NVMe VROC RAID grouping technology |
| System Expansion Bus | Native PCIe 5.0 bus architecture, backward compatible with PCIe 4.0 / PCIe 3.0 expansion specifications |
| Network Expansion Standard | OCP 3.0 standard network slot, expandable 1G/10G/25G/100G Ethernet adapters, support TCP/IP, VLAN, Link Aggregation protocols |
| Out-of-Band Remote Management | Built-in HDM2 (AST2600 chip), comply with IPMI 2.0, Redfish, SNMP v2c/v3 management industry protocols |
| Remote O&M Core Features | Remote KVM, virtual media mounting, real-time hardware monitoring, fault alarm notification, remote power on/off & batch device management |
| Power Supply Configuration | Optional 1+1 redundant CRPS platinum high-efficiency PSU, support AC input & 240V HVDC telecom power input mode |
| Thermal Dissipation Design | Modular hot-swappable fan group with intelligent PWM speed regulation, front honeycomb large air inlet grille for optimized straight airflow |
| Front & Rear External I/O Ports | Front: USB, power button, status indicator; Rear: multiple USB3.2, VGA, RJ45 LAN, independent HDM dedicated management port |
| System Security Protection | Support TPM2.0 secure encryption chip, secure boot, hardware access lock and enterprise data encryption protection function |
| Supported Operating Systems & Hypervisor | Windows Server, RHEL, SUSE, Ubuntu, VMware ESXi, KVM, Citrix Hypervisor mainstream virtualization platforms |
| Operating Environment | Operating ambient temperature: 10℃~35℃; storage temperature: -40℃~65℃, designed for standard IDC and enterprise computer room |
| Main Applicable Scenarios | Cloud compute node, server virtualization cluster, all-flash distributed storage, enterprise core database, edge computing and lightweight container cluster |
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Payment Terms
We accept T/T payments in USD or RMB. A 50% deposit is required to arrange production and stock. The balance must be paid before shipment after you inspect the goods at our warehouse.
Warranty Policy
- Original new sealed enterprise hardware: 3-year warranty
- Original new sealed consumer devices: 1-year warranty
Shipping Methods
- In-Stock Items**: Shipped within 3 business days after order confirmation.
- Customized Orders**: Delivery lead time is approximately 30 days from the date of order placement and receipt of advance payment (Guangzhou, China warehouse).
We provide professional freight forwarding services to ensure product quality and cargo safety. You may also pick up goods directly at our warehouse.
| Brand | H3C |
|---|---|
| Type | Rack Server |
| Size | 1U Chassis 42.9mm (H) × 434.6mm (W) × 777mm (D) (excluding security panel) (E1.S model depth 835mm) 42.9mm (H) × 434.6mm (W) × 805mm (D) (including security panel) (E1.S model depth 863mm) |
| Model | |
| MOQ | 2 |







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